usb: musb: introduce DA8xx/OMAP-L1x glue layer

Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>

drivers/usb/musb/Kconfig

@@ -45,6 +45,9 @@ config USB_MUSB_SOC
 comment "DaVinci 35x and 644x USB support"
 	depends on USB_MUSB_HDRC && ARCH_DAVINCI_DMx
 
+comment "DA8xx/OMAP-L1x USB support"
+	depends on USB_MUSB_HDRC && ARCH_DAVINCI_DA8XX
+
 comment "OMAP 243x high speed USB support"
 	depends on USB_MUSB_HDRC && ARCH_OMAP2430
 
@@ -144,7 +147,7 @@ config USB_MUSB_HDRC_HCD
 config MUSB_PIO_ONLY
 	bool 'Disable DMA (always use PIO)'
 	depends on USB_MUSB_HDRC
-	default y if USB_TUSB6010
+	default USB_TUSB6010 || ARCH_DAVINCI_DA8XX
 	help
 	  All data is copied between memory and FIFO by the CPU.
 	  DMA controllers are ignored.

drivers/usb/musb/Makefile

@@ -10,6 +10,10 @@ ifeq ($(CONFIG_ARCH_DAVINCI_DMx),y)
 	musb_hdrc-objs	+= davinci.o
 endif
 
+ifeq ($(CONFIG_ARCH_DAVINCI_DA8XX),y)
+	musb_hdrc-objs	+= da8xx.o
+endif
+
 ifeq ($(CONFIG_USB_TUSB6010),y)
 	musb_hdrc-objs	+= tusb6010.o
 endif