Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/g…

…it/rzhang/linux

Pull thermal management update from Zhang Rui:
 "Highlights:

   - Introduction of thermal policy support, together with three new
     thermal governors, including step_wise, user_space, fire_share.

   - Introduction of ST-Ericsson db8500_thermal driver and ST-Ericsson
     db8500_cpufreq_cooling driver.

   - Thermal Kconfig file and Makefile refactor.

   - Fixes for generic thermal layer, generic cpucooling, rcar thermal
     driver and Exynos thermal driver."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  Thermal: Fix DEFAULT_THERMAL_GOVERNOR
  Thermal: fix a NULL pointer dereference when generic thermal layer is built as a module
  thermal: rcar: add rcar_zone_to_priv() macro
  thermal: rcar: fixup the unit of temperature
  thermal: cpu cooling: allow module builds
  thermal: cpu cooling: use const parameter while registering
  Thermal: Add ST-Ericsson DB8500 thermal properties and platform data.
  Thermal: Add ST-Ericsson DB8500 thermal driver.
  drivers/thermal/Makefile refactor
  Exynos: Add missing dependency
  Refactor drivers/thermal/Kconfig
  thermal: cpu_cooling: Make 'notify_device' static
  Thermal: Remove the cooling_cpufreq_list.
  Thermal: fix bug of counting cpu frequencies.
  Thermal: add indent for code alignment.
  thermal: rcar_thermal: remove explicitly used devm_kfree/iounap()
  thermal: user_space: Add missing static storage class specifiers
  thermal: fair_share: Add missing static storage class specifiers
  thermal: step_wise: Add missing static storage class specifiers
  Thermal: Fix oops and unlocking in thermal_sys.c
  ...

Documentation/devicetree/bindings/thermal/db8500-thermal.txt

@@ -0,0 +1,44 @@
+* ST-Ericsson DB8500 Thermal
+
+** Thermal node properties:
+
+- compatible : "stericsson,db8500-thermal";
+- reg : address range of the thermal sensor registers;
+- interrupts : interrupts generated from PRCMU;
+- interrupt-names : "IRQ_HOTMON_LOW" and "IRQ_HOTMON_HIGH";
+- num-trips : number of total trip points, this is required, set it 0 if none,
+  if greater than 0, the following properties must be defined;
+- tripN-temp : temperature of trip point N, should be in ascending order;
+- tripN-type : type of trip point N, should be one of "active" "passive" "hot"
+  "critical";
+- tripN-cdev-num : number of the cooling devices which can be bound to trip
+  point N, this is required if trip point N is defined, set it 0 if none,
+  otherwise the following cooling device names must be defined;
+- tripN-cdev-nameM : name of the No. M cooling device of trip point N;
+
+Usually the num-trips and tripN-*** are separated in board related dts files.
+
+Example:
+thermal@801573c0 {
+	compatible = "stericsson,db8500-thermal";
+	reg = <0x801573c0 0x40>;
+	interrupts = <21 0x4>, <22 0x4>;
+	interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";
+
+	num-trips = <3>;
+
+	trip0-temp = <75000>;
+	trip0-type = "active";
+	trip0-cdev-num = <1>;
+	trip0-cdev-name0 = "thermal-cpufreq-0";
+
+	trip1-temp = <80000>;
+	trip1-type = "active";
+	trip1-cdev-num = <2>;
+	trip1-cdev-name0 = "thermal-cpufreq-0";
+	trip1-cdev-name1 = "thermal-fan";
+
+	trip2-temp = <85000>;
+	trip2-type = "critical";
+	trip2-cdev-num = <0>;
+}

Documentation/thermal/sysfs-api.txt

@@ -112,6 +112,29 @@ temperature) and throttle appropriate devices.
     trip: indicates which trip point the cooling devices is associated with
 	  in this thermal zone.
 
+1.4 Thermal Zone Parameters
+1.4.1 struct thermal_bind_params
+    This structure defines the following parameters that are used to bind
+    a zone with a cooling device for a particular trip point.
+    .cdev: The cooling device pointer
+    .weight: The 'influence' of a particular cooling device on this zone.
+             This is on a percentage scale. The sum of all these weights
+             (for a particular zone) cannot exceed 100.
+    .trip_mask:This is a bit mask that gives the binding relation between
+               this thermal zone and cdev, for a particular trip point.
+               If nth bit is set, then the cdev and thermal zone are bound
+               for trip point n.
+    .match: This call back returns success(0) if the 'tz and cdev' need to
+	    be bound, as per platform data.
+1.4.2 struct thermal_zone_params
+    This structure defines the platform level parameters for a thermal zone.
+    This data, for each thermal zone should come from the platform layer.
+    This is an optional feature where some platforms can choose not to
+    provide this data.
+    .governor_name: Name of the thermal governor used for this zone
+    .num_tbps: Number of thermal_bind_params entries for this zone
+    .tbp: thermal_bind_params entries
+
 2. sysfs attributes structure
 
 RO	read only value
@@ -126,6 +149,7 @@ Thermal zone device sys I/F, created once it's registered:
     |---type:			Type of the thermal zone
     |---temp:			Current temperature
     |---mode:			Working mode of the thermal zone
+    |---policy:			Thermal governor used for this zone
     |---trip_point_[0-*]_temp:	Trip point temperature
     |---trip_point_[0-*]_type:	Trip point type
     |---trip_point_[0-*]_hyst:	Hysteresis value for this trip point
@@ -187,6 +211,10 @@ mode
 			  charge of the thermal management.
 	RW, Optional
 
+policy
+	One of the various thermal governors used for a particular zone.
+	RW, Required
+
 trip_point_[0-*]_temp
 	The temperature above which trip point will be fired.
 	Unit: millidegree Celsius
@@ -264,6 +292,7 @@ method, the sys I/F structure will be built like this:
     |---type:			acpitz
     |---temp:			37000
     |---mode:			enabled
+    |---policy:			step_wise
     |---trip_point_0_temp:	100000
     |---trip_point_0_type:	critical
     |---trip_point_1_temp:	80000
@@ -305,3 +334,38 @@ to a thermal_zone_device when it registers itself with the framework. The
 event will be one of:{THERMAL_AUX0, THERMAL_AUX1, THERMAL_CRITICAL,
 THERMAL_DEV_FAULT}. Notification can be sent when the current temperature
 crosses any of the configured thresholds.
+
+5. Export Symbol APIs:
+
+5.1: get_tz_trend:
+This function returns the trend of a thermal zone, i.e the rate of change
+of temperature of the thermal zone. Ideally, the thermal sensor drivers
+are supposed to implement the callback. If they don't, the thermal
+framework calculated the trend by comparing the previous and the current
+temperature values.
+
+5.2:get_thermal_instance:
+This function returns the thermal_instance corresponding to a given
+{thermal_zone, cooling_device, trip_point} combination. Returns NULL
+if such an instance does not exist.
+
+5.3:notify_thermal_framework:
+This function handles the trip events from sensor drivers. It starts
+throttling the cooling devices according to the policy configured.
+For CRITICAL and HOT trip points, this notifies the respective drivers,
+and does actual throttling for other trip points i.e ACTIVE and PASSIVE.
+The throttling policy is based on the configured platform data; if no
+platform data is provided, this uses the step_wise throttling policy.
+
+5.4:thermal_cdev_update:
+This function serves as an arbitrator to set the state of a cooling
+device. It sets the cooling device to the deepest cooling state if
+possible.
+
+5.5:thermal_register_governor:
+This function lets the various thermal governors to register themselves
+with the Thermal framework. At run time, depending on a zone's platform
+data, a particular governor is used for throttling.
+
+5.6:thermal_unregister_governor:
+This function unregisters a governor from the thermal framework.

arch/arm/boot/dts/dbx5x0.dtsi

@@ -203,6 +203,14 @@
 				reg = <0x80157450 0xC>;
 			};
 
+			thermal@801573c0 {
+				compatible = "stericsson,db8500-thermal";
+				reg = <0x801573c0 0x40>;
+				interrupts = <21 0x4>, <22 0x4>;
+				interrupt-names = "IRQ_HOTMON_LOW", "IRQ_HOTMON_HIGH";
+				status = "disabled";
+			 };
+
 			db8500-prcmu-regulators {
 				compatible = "stericsson,db8500-prcmu-regulator";
 
@@ -660,5 +668,11 @@
 			ranges = <0 0x50000000 0x4000000>;
 			status = "disabled";
 		};
+
+		cpufreq-cooling {
+			compatible = "stericsson,db8500-cpufreq-cooling";
+			status = "disabled";
+		 };
+
 	};
 };

arch/arm/boot/dts/snowball.dts

@@ -99,6 +99,33 @@
 			status = "okay";
 		};
 
+		prcmu@80157000 {
+			thermal@801573c0 {
+				num-trips = <4>;
+
+				trip0-temp = <70000>;
+				trip0-type = "active";
+				trip0-cdev-num = <1>;
+				trip0-cdev-name0 = "thermal-cpufreq-0";
+
+				trip1-temp = <75000>;
+				trip1-type = "active";
+				trip1-cdev-num = <1>;
+				trip1-cdev-name0 = "thermal-cpufreq-0";
+
+				trip2-temp = <80000>;
+				trip2-type = "active";
+				trip2-cdev-num = <1>;
+				trip2-cdev-name0 = "thermal-cpufreq-0";
+
+				trip3-temp = <85000>;
+				trip3-type = "critical";
+				trip3-cdev-num = <0>;
+
+				status = "okay";
+			 };
+		};
+
 		external-bus@50000000 {
 			status = "okay";
 
@@ -183,5 +210,9 @@
 				reg = <0x33>;
 			};
 		};
+
+		cpufreq-cooling {
+			status = "okay";
+		};
 	};
 };

arch/arm/configs/u8500_defconfig

@@ -69,6 +69,8 @@ CONFIG_GPIO_TC3589X=y
 CONFIG_POWER_SUPPLY=y
 CONFIG_AB8500_BM=y
 CONFIG_AB8500_BATTERY_THERM_ON_BATCTRL=y
+CONFIG_THERMAL=y
+CONFIG_CPU_THERMAL=y
 CONFIG_MFD_STMPE=y
 CONFIG_MFD_TC3589X=y
 CONFIG_AB5500_CORE=y

arch/arm/mach-ux500/board-mop500.c

@@ -16,6 +16,7 @@
 #include <linux/io.h>
 #include <linux/i2c.h>
 #include <linux/platform_data/i2c-nomadik.h>
+#include <linux/platform_data/db8500_thermal.h>
 #include <linux/gpio.h>
 #include <linux/amba/bus.h>
 #include <linux/amba/pl022.h>
@@ -228,6 +229,67 @@ static struct ab8500_platform_data ab8500_platdata = {
 	.codec		= &ab8500_codec_pdata,
 };
 
+/*
+ * Thermal Sensor
+ */
+
+static struct resource db8500_thsens_resources[] = {
+	{
+		.name = "IRQ_HOTMON_LOW",
+		.start  = IRQ_PRCMU_HOTMON_LOW,
+		.end    = IRQ_PRCMU_HOTMON_LOW,
+		.flags  = IORESOURCE_IRQ,
+	},
+	{
+		.name = "IRQ_HOTMON_HIGH",
+		.start  = IRQ_PRCMU_HOTMON_HIGH,
+		.end    = IRQ_PRCMU_HOTMON_HIGH,
+		.flags  = IORESOURCE_IRQ,
+	},
+};
+
+static struct db8500_thsens_platform_data db8500_thsens_data = {
+	.trip_points[0] = {
+		.temp = 70000,
+		.type = THERMAL_TRIP_ACTIVE,
+		.cdev_name = {
+			[0] = "thermal-cpufreq-0",
+		},
+	},
+	.trip_points[1] = {
+		.temp = 75000,
+		.type = THERMAL_TRIP_ACTIVE,
+		.cdev_name = {
+			[0] = "thermal-cpufreq-0",
+		},
+	},
+	.trip_points[2] = {
+		.temp = 80000,
+		.type = THERMAL_TRIP_ACTIVE,
+		.cdev_name = {
+			[0] = "thermal-cpufreq-0",
+		},
+	},
+	.trip_points[3] = {
+		.temp = 85000,
+		.type = THERMAL_TRIP_CRITICAL,
+	},
+	.num_trips = 4,
+};
+
+static struct platform_device u8500_thsens_device = {
+	.name           = "db8500-thermal",
+	.resource       = db8500_thsens_resources,
+	.num_resources  = ARRAY_SIZE(db8500_thsens_resources),
+	.dev	= {
+		.platform_data	= &db8500_thsens_data,
+	},
+};
+
+static struct platform_device u8500_cpufreq_cooling_device = {
+	.name           = "db8500-cpufreq-cooling",
+};
+
 /*
  * TPS61052
  */
@@ -583,6 +645,8 @@ static struct platform_device *snowball_platform_devs[] __initdata = {
 	&snowball_key_dev,
 	&snowball_sbnet_dev,
 	&snowball_gpio_en_3v3_regulator_dev,
+	&u8500_thsens_device,
+	&u8500_cpufreq_cooling_device,
 };
 
 static void __init mop500_init_machine(void)

drivers/acpi/thermal.c

@@ -900,14 +900,14 @@ static int acpi_thermal_register_thermal_zone(struct acpi_thermal *tz)
 	if (tz->trips.passive.flags.valid)
 		tz->thermal_zone =
 			thermal_zone_device_register("acpitz", trips, 0, tz,
-						     &acpi_thermal_zone_ops,
+						&acpi_thermal_zone_ops, NULL,
 						     tz->trips.passive.tsp*100,
 						     tz->polling_frequency*100);
 	else
 		tz->thermal_zone =
 			thermal_zone_device_register("acpitz", trips, 0, tz,
-						     &acpi_thermal_zone_ops, 0,
-						     tz->polling_frequency*100);
+						&acpi_thermal_zone_ops, NULL,
+						0, tz->polling_frequency*100);
 	if (IS_ERR(tz->thermal_zone))
 		return -ENODEV;
 

drivers/platform/x86/acerhdf.c

@@ -662,7 +662,7 @@ static int acerhdf_register_thermal(void)
 		return -EINVAL;
 
 	thz_dev = thermal_zone_device_register("acerhdf", 1, 0, NULL,
-					      &acerhdf_dev_ops, 0,
+					      &acerhdf_dev_ops, NULL, 0,
 					      (kernelmode) ? interval*1000 : 0);
 	if (IS_ERR(thz_dev))
 		return -EINVAL;

drivers/platform/x86/intel_mid_thermal.c

@@ -502,7 +502,7 @@ static int mid_thermal_probe(struct platform_device *pdev)
 			goto err;
 		}
 		pinfo->tzd[i] = thermal_zone_device_register(name[i],
-				0, 0, td_info, &tzd_ops, 0, 0);
+				0, 0, td_info, &tzd_ops, NULL, 0, 0);
 		if (IS_ERR(pinfo->tzd[i])) {
 			kfree(td_info);
 			ret = PTR_ERR(pinfo->tzd[i]);

drivers/power/power_supply_core.c

@@ -201,7 +201,7 @@ static int psy_register_thermal(struct power_supply *psy)
 	for (i = 0; i < psy->num_properties; i++) {
 		if (psy->properties[i] == POWER_SUPPLY_PROP_TEMP) {
 			psy->tzd = thermal_zone_device_register(psy->name, 0, 0,
-					psy, &psy_tzd_ops, 0, 0);
+					psy, &psy_tzd_ops, NULL, 0, 0);
 			if (IS_ERR(psy->tzd))
 				return PTR_ERR(psy->tzd);
 			break;

drivers/staging/omap-thermal/omap-thermal-common.c

@@ -270,7 +270,7 @@ int omap_thermal_expose_sensor(struct omap_bandgap *bg_ptr, int id,
 	/* Create thermal zone */
 	data->omap_thermal = thermal_zone_device_register(domain,
 				OMAP_TRIP_NUMBER, 0, data, &omap_thermal_ops,
-				FAST_TEMP_MONITORING_RATE,
+				NULL, FAST_TEMP_MONITORING_RATE,
 				FAST_TEMP_MONITORING_RATE);
 	if (IS_ERR_OR_NULL(data->omap_thermal)) {
 		dev_err(bg_ptr->dev, "thermal zone device is NULL\n");