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Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/…
…rzhang/linux Pull thermal management updates from Zhang Rui: "There are not too many changes this time, except two new platform thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal driver, and a couple of small fixes. Highlights: - move the ti-soc-thermal driver out of the staging tree to the thermal tree. - introduce the x86_pkg_temp_thermal driver. This driver registers CPU digital temperature package level sensor as a thermal zone. - small fixes/cleanups including removing redundant use of platform_set_drvdata() and of_match_ptr for all platform thermal drivers" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits) thermal: cpu_cooling: fix stub function thermal: ti-soc-thermal: use standard GPIO DT bindings thermal: MAINTAINERS: Add git tree path for SoC specific updates thermal: fix x86_pkg_temp_thermal.c build and Kconfig Thermal: Documentation for x86 package temperature thermal driver Thermal: CPU Package temperature thermal thermal: consider emul_temperature while computing trend thermal: ti-soc-thermal: add DT example for DRA752 chip thermal: ti-soc-thermal: add dra752 chip to device table thermal: ti-soc-thermal: add thermal data for DRA752 chips thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL thermal: ti-soc-thermal: freeze FSM while computing trend thermal: ti-soc-thermal: remove external heat while extrapolating hotspot thermal: ti-soc-thermal: update DT reference for OMAP5430 x86, mcheck, therm_throt: Process package thresholds thermal: cpu_cooling: fix 'descend' check in get_property() Thermal: spear: Remove redundant use of of_match_ptr Thermal: kirkwood: Remove redundant use of of_match_ptr Thermal: dove: Remove redundant use of of_match_ptr Thermal: armada: Remove redundant use of of_match_ptr ...
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Kernel driver: x86_pkg_temp_thermal | ||
=================== | ||
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Supported chips: | ||
* x86: with package level thermal management | ||
(Verify using: CPUID.06H:EAX[bit 6] =1) | ||
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Authors: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> | ||
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Reference | ||
--- | ||
Intel® 64 and IA-32 Architectures Software Developer’s Manual (Jan, 2013): | ||
Chapter 14.6: PACKAGE LEVEL THERMAL MANAGEMENT | ||
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Description | ||
--------- | ||
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This driver register CPU digital temperature package level sensor as a thermal | ||
zone with maximum two user mode configurable trip points. Number of trip points | ||
depends on the capability of the package. Once the trip point is violated, | ||
user mode can receive notification via thermal notification mechanism and can | ||
take any action to control temperature. | ||
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Threshold management | ||
-------------------- | ||
Each package will register as a thermal zone under /sys/class/thermal. | ||
Example: | ||
/sys/class/thermal/thermal_zone1 | ||
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This contains two trip points: | ||
- trip_point_0_temp | ||
- trip_point_1_temp | ||
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User can set any temperature between 0 to TJ-Max temperature. Temperature units | ||
are in milli-degree Celsius. Refer to "Documentation/thermal/sysfs-api.txt" for | ||
thermal sys-fs details. | ||
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Any value other than 0 in these trip points, can trigger thermal notifications. | ||
Setting 0, stops sending thermal notifications. | ||
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Thermal notifications: To get kobject-uevent notifications, set the thermal zone | ||
policy to "user_space". For example: echo -n "user_space" > policy | ||
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