Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/g…

…it/rzhang/linux into thermal

Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>

Signed-off-by: Len Brown <len.brown@intel.com>

Documentation/thermal/cpu-cooling-api.txt

@@ -0,0 +1,32 @@
+CPU cooling APIs How To
+===================================
+
+Written by Amit Daniel Kachhap <amit.kachhap@linaro.org>
+
+Updated: 12 May 2012
+
+Copyright (c)  2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
+
+0. Introduction
+
+The generic cpu cooling(freq clipping) provides registration/unregistration APIs
+to the caller. The binding of the cooling devices to the trip point is left for
+the user. The registration APIs returns the cooling device pointer.
+
+1. cpu cooling APIs
+
+1.1 cpufreq registration/unregistration APIs
+1.1.1 struct thermal_cooling_device *cpufreq_cooling_register(
+	struct cpumask *clip_cpus)
+
+    This interface function registers the cpufreq cooling device with the name
+    "thermal-cpufreq-%x". This api can support multiple instances of cpufreq
+    cooling devices.
+
+   clip_cpus: cpumask of cpus where the frequency constraints will happen.
+
+1.1.2 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+
+    This interface function unregisters the "thermal-cpufreq-%x" cooling device.
+
+    cdev: Cooling device pointer which has to be unregistered.

Documentation/hwmon/exynos4_tmu → Documentation/thermal/exynos_thermal

@@ -46,36 +46,7 @@ The threshold levels are defined as follows:
   The threshold and each trigger_level are set
   through the corresponding registers.
 
-When an interrupt occurs, this driver notify user space of
-one of four threshold levels for the interrupt
-through kobject_uevent_env and sysfs_notify functions.
+When an interrupt occurs, this driver notify kernel thermal framework
+with the function exynos4_report_trigger.
 Although an interrupt condition for level_0 can be set,
-it is not notified to user space through sysfs_notify function.
-
-Sysfs Interface
----------------
-name		name of the temperature sensor
-		RO
-
-temp1_input	temperature
-		RO
-
-temp1_max	temperature for level_1 interrupt
-		RO
-
-temp1_crit	temperature for level_2 interrupt
-		RO
-
-temp1_emergency	temperature for level_3 interrupt
-		RO
-
-temp1_max_alarm	alarm for level_1 interrupt
-		RO
-
-temp1_crit_alarm
-		alarm for level_2 interrupt
-		RO
-
-temp1_emergency_alarm
-		alarm for level_3 interrupt
-		RO
+it can be used to synchronize the cooling action.

Documentation/thermal/sysfs-api.txt

@@ -84,7 +84,8 @@ temperature) and throttle appropriate devices.
 
 1.3 interface for binding a thermal zone device with a thermal cooling device
 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
-		int trip, struct thermal_cooling_device *cdev);
+	int trip, struct thermal_cooling_device *cdev,
+	unsigned long upper, unsigned long lower);
 
     This interface function bind a thermal cooling device to the certain trip
     point of a thermal zone device.
@@ -93,6 +94,12 @@ temperature) and throttle appropriate devices.
     cdev: thermal cooling device
     trip: indicates which trip point the cooling devices is associated with
 	  in this thermal zone.
+    upper:the Maximum cooling state for this trip point.
+          THERMAL_NO_LIMIT means no upper limit,
+	  and the cooling device can be in max_state.
+    lower:the Minimum cooling state can be used for this trip point.
+          THERMAL_NO_LIMIT means no lower limit,
+	  and the cooling device can be in cooling state 0.
 
 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
 		int trip, struct thermal_cooling_device *cdev);

drivers/acpi/thermal.c

@@ -708,6 +708,40 @@ static int thermal_get_crit_temp(struct thermal_zone_device *thermal,
 		return -EINVAL;
 }
 
+static int thermal_get_trend(struct thermal_zone_device *thermal,
+				int trip, enum thermal_trend *trend)
+{
+	struct acpi_thermal *tz = thermal->devdata;
+	enum thermal_trip_type type;
+	int i;
+
+	if (thermal_get_trip_type(thermal, trip, &type))
+		return -EINVAL;
+
+	if (type == THERMAL_TRIP_ACTIVE) {
+		/* aggressive active cooling */
+		*trend = THERMAL_TREND_RAISING;
+		return 0;
+	}
+
+	/*
+	 * tz->temperature has already been updated by generic thermal layer,
+	 * before this callback being invoked
+	 */
+	i = (tz->trips.passive.tc1 * (tz->temperature - tz->last_temperature))
+		+ (tz->trips.passive.tc2
+		* (tz->temperature - tz->trips.passive.temperature));
+
+	if (i > 0)
+		*trend = THERMAL_TREND_RAISING;
+	else if (i < 0)
+		*trend = THERMAL_TREND_DROPPING;
+	else
+		*trend = THERMAL_TREND_STABLE;
+	return 0;
+}
+
+
 static int thermal_notify(struct thermal_zone_device *thermal, int trip,
 			   enum thermal_trip_type trip_type)
 {
@@ -731,11 +765,9 @@ static int thermal_notify(struct thermal_zone_device *thermal, int trip,
 	return 0;
 }
 
-typedef int (*cb)(struct thermal_zone_device *, int,
-		  struct thermal_cooling_device *);
 static int acpi_thermal_cooling_device_cb(struct thermal_zone_device *thermal,
 					struct thermal_cooling_device *cdev,
-					cb action)
+					bool bind)
 {
 	struct acpi_device *device = cdev->devdata;
 	struct acpi_thermal *tz = thermal->devdata;
@@ -759,11 +791,19 @@ static int acpi_thermal_cooling_device_cb(struct thermal_zone_device *thermal,
 		    i++) {
 			handle = tz->trips.passive.devices.handles[i];
 			status = acpi_bus_get_device(handle, &dev);
-			if (ACPI_SUCCESS(status) && (dev == device)) {
-				result = action(thermal, trip, cdev);
-				if (result)
-					goto failed;
-			}
+			if (ACPI_FAILURE(status) || dev != device)
+				continue;
+			if (bind)
+				result =
+					thermal_zone_bind_cooling_device
+					(thermal, trip, cdev,
+					 THERMAL_NO_LIMIT, THERMAL_NO_LIMIT);
+			else
+				result =
+					thermal_zone_unbind_cooling_device
+					(thermal, trip, cdev);
+			if (result)
+				goto failed;
 		}
 	}
 
@@ -776,19 +816,32 @@ static int acpi_thermal_cooling_device_cb(struct thermal_zone_device *thermal,
 		    j++) {
 			handle = tz->trips.active[i].devices.handles[j];
 			status = acpi_bus_get_device(handle, &dev);
-			if (ACPI_SUCCESS(status) && (dev == device)) {
-				result = action(thermal, trip, cdev);
-				if (result)
-					goto failed;
-			}
+			if (ACPI_FAILURE(status) || dev != device)
+				continue;
+			if (bind)
+				result = thermal_zone_bind_cooling_device
+					(thermal, trip, cdev,
+					 THERMAL_NO_LIMIT, THERMAL_NO_LIMIT);
+			else
+				result = thermal_zone_unbind_cooling_device
+					(thermal, trip, cdev);
+			if (result)
+				goto failed;
 		}
 	}
 
 	for (i = 0; i < tz->devices.count; i++) {
 		handle = tz->devices.handles[i];
 		status = acpi_bus_get_device(handle, &dev);
 		if (ACPI_SUCCESS(status) && (dev == device)) {
-			result = action(thermal, -1, cdev);
+			if (bind)
+				result = thermal_zone_bind_cooling_device
+						(thermal, -1, cdev,
+						 THERMAL_NO_LIMIT,
+						 THERMAL_NO_LIMIT);
+			else
+				result = thermal_zone_unbind_cooling_device
+						(thermal, -1, cdev);
 			if (result)
 				goto failed;
 		}
@@ -802,16 +855,14 @@ static int
 acpi_thermal_bind_cooling_device(struct thermal_zone_device *thermal,
 					struct thermal_cooling_device *cdev)
 {
-	return acpi_thermal_cooling_device_cb(thermal, cdev,
-				thermal_zone_bind_cooling_device);
+	return acpi_thermal_cooling_device_cb(thermal, cdev, true);
 }
 
 static int
 acpi_thermal_unbind_cooling_device(struct thermal_zone_device *thermal,
 					struct thermal_cooling_device *cdev)
 {
-	return acpi_thermal_cooling_device_cb(thermal, cdev,
-				thermal_zone_unbind_cooling_device);
+	return acpi_thermal_cooling_device_cb(thermal, cdev, false);
 }
 
 static const struct thermal_zone_device_ops acpi_thermal_zone_ops = {
@@ -823,6 +874,7 @@ static const struct thermal_zone_device_ops acpi_thermal_zone_ops = {
 	.get_trip_type = thermal_get_trip_type,
 	.get_trip_temp = thermal_get_trip_temp,
 	.get_crit_temp = thermal_get_crit_temp,
+	.get_trend = thermal_get_trend,
 	.notify = thermal_notify,
 };
 
@@ -849,15 +901,12 @@ static int acpi_thermal_register_thermal_zone(struct acpi_thermal *tz)
 		tz->thermal_zone =
 			thermal_zone_device_register("acpitz", trips, 0, tz,
 						     &acpi_thermal_zone_ops,
-						     tz->trips.passive.tc1,
-						     tz->trips.passive.tc2,
 						     tz->trips.passive.tsp*100,
 						     tz->polling_frequency*100);
 	else
 		tz->thermal_zone =
 			thermal_zone_device_register("acpitz", trips, 0, tz,
-						     &acpi_thermal_zone_ops,
-						     0, 0, 0,
+						     &acpi_thermal_zone_ops, 0,
 						     tz->polling_frequency*100);
 	if (IS_ERR(tz->thermal_zone))
 		return -ENODEV;

drivers/hwmon/Kconfig

@@ -334,16 +334,6 @@ config SENSORS_DA9052_ADC
 	  This driver can also be built as module. If so, the module
 	  will be called da9052-hwmon.
 
-config SENSORS_EXYNOS4_TMU
-	tristate "Temperature sensor on Samsung EXYNOS4"
-	depends on ARCH_EXYNOS4
-	help
-	  If you say yes here you get support for TMU (Thermal Management
-	  Unit) on SAMSUNG EXYNOS4 series of SoC.
-
-	  This driver can also be built as a module. If so, the module
-	  will be called exynos4-tmu.
-
 config SENSORS_I5K_AMB
 	tristate "FB-DIMM AMB temperature sensor on Intel 5000 series chipsets"
 	depends on PCI

drivers/hwmon/Makefile

@@ -50,7 +50,6 @@ obj-$(CONFIG_SENSORS_DS1621)	+= ds1621.o
 obj-$(CONFIG_SENSORS_EMC1403)	+= emc1403.o
 obj-$(CONFIG_SENSORS_EMC2103)	+= emc2103.o
 obj-$(CONFIG_SENSORS_EMC6W201)	+= emc6w201.o
-obj-$(CONFIG_SENSORS_EXYNOS4_TMU)	+= exynos4_tmu.o
 obj-$(CONFIG_SENSORS_F71805F)	+= f71805f.o
 obj-$(CONFIG_SENSORS_F71882FG)	+= f71882fg.o
 obj-$(CONFIG_SENSORS_F75375S)	+= f75375s.o