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thermal/x86_pkg_temp_thermal: Support multi-die/package
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Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.

Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
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Zhang Rui authored and Thomas Gleixner committed May 23, 2019
1 parent 32fb480 commit 724adec
Showing 1 changed file with 4 additions and 4 deletions.
8 changes: 4 additions & 4 deletions drivers/thermal/intel/x86_pkg_temp_thermal.c
Original file line number Diff line number Diff line change
Expand Up @@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
*/
static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
{
int pkgid = topology_logical_package_id(cpu);
int pkgid = topology_logical_die_id(cpu);

if (pkgid >= 0 && pkgid < max_packages)
return packages[pkgid];
Expand Down Expand Up @@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)

static int pkg_temp_thermal_device_add(unsigned int cpu)
{
int pkgid = topology_logical_package_id(cpu);
int pkgid = topology_logical_die_id(cpu);
u32 tj_max, eax, ebx, ecx, edx;
struct pkg_device *pkgdev;
int thres_count, err;
Expand Down Expand Up @@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
* worker will see the package anymore.
*/
if (lastcpu) {
packages[topology_logical_package_id(cpu)] = NULL;
packages[topology_logical_die_id(cpu)] = NULL;
/* After this point nothing touches the MSR anymore. */
wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
Expand Down Expand Up @@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
if (!x86_match_cpu(pkg_temp_thermal_ids))
return -ENODEV;

max_packages = topology_max_packages();
max_packages = topology_max_packages() * topology_max_die_per_package();
packages = kcalloc(max_packages, sizeof(struct pkg_device *),
GFP_KERNEL);
if (!packages)
Expand Down

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